Washington State University-led researchers have developed a chip-sized processor and 3D printed antenna arrays that could someday lead to flexible and wearable wireless systems and improved ...
NEO Semiconductor has announced that it has developed the "world's first 3D NAND-like DRAM cell array," which aims to increase DRAM chip density using established 3D stacking technology. Designed to ...
(Nanowerk News) Industry 4.0 requires simple solutions for complex functions. Optical sensors, such as pinhole cameras, can deliver a depth of focus and reasonable resolution, but they suffer from low ...
- Technical innovation cuts production cycle time by up to six months- First 3D-printed solar arrays will fly Spectrolab solar cells aboard small satellites built by Millennium Space Systems- Designed ...
The new FARO Cobalt 3D Imager is equipped with dedicated on-board processors – an industry first. The smart sensor allows unique multi-imager array configurations enabling industrial manufacturers to ...
The 3D AR effect of the meta-II NED with the major components of the metalens array and the micro-display. The virtual 3D images are reconstructed to coincide with the chess pieces. Integral imaging ...
Unlike scaling practices in 2D NAND technology, the direct way to reduce bit costs and increase chip density in 3D NAND is by adding layers. In 2013, Samsung shipped the first V-NAND product using 24 ...
Prototype of a chip-scale RF signal processor with 3D-printed antenna arrays for antenna-in-structure or wearable wireless systems. PULLMAN, Wash. – Washington State University-led researchers have ...
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