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This new 3D chip could smash AI’s biggest bottleneck

Artificial intelligence has raced ahead so quickly that its biggest constraint is no longer clever algorithms but the plumbing that feeds them data. A new generation of 3D chips, built by stacking ...
The University of Chicago Chronicle

New grant launches 3D chip design hub at UChicago

Funding from the U.S. National Science Foundation is part of a broader push to propel domestic computer chip manufacturing A $3 million grant from the U.S. National Science Foundation (NSF) to the ...
SiliconANGLE

D-Matrix reveals plan to break through AI’s ‘memory wall’ with 3D DRAM-based chip architecture

Artificial intelligence computing startup D-Matrix Corp. said today it has developed a new implementation of 3D dynamic random-access memory technology that promises to accelerate inference workloads ...
Greek Reporter

China Bets on Optical Computer Chips to Power the Next Wave of AI

China is accelerating efforts in optical computer chips to overcome chip restrictions and lead the next wave of AI innovation ...
AZOM

Breakthrough in 3D Chip Integration Promises Faster, More Efficient High-Performance Computing

A new power supply technology for 3D-integrated chips has been developed using a vertically stacked architecture, where processing units are positioned directly above dynamic random access memory ...