Feb. 19, 2026 — Siemens has won in the “Packaging: Design” category at the 2026 Chiplet Summit Best of Show Awards for its Innovator3D IC solution. The solution provides a fast, predictable ...

SINGAPORE, July 9, 2025 /PRNewswire/ -- As digital transformation sweeps across the global packaging sector, Pacdora has emerged as a key force driving change. As a leading online 3D packaging design ...

Cadence is trying to automate more aspects of the chip design process with Integrity 3D-IC, a suite of software tools it says can help engineers develop faster, less power-hungry chips using 3D ...

(MENAFN- EIN Presswire) EINPresswire/ -- "The packaging industry is witnessing a significant transformation as digital tools reshape how packaging designs are created and optimized. Design software ...

Various techniques for embedding 3D packaging to boost power density. Different methods for cooling chips using 3D packaging. New and emerging technologies for 3D packaging are being deployed at the ...

(MENAFN- PR Newswire) Since its launch in March 2022, Pacdora has quickly gained traction, completing a nearly $10 million Series A funding round and reaching a valuation of over $100 million.