TAIPEI, Feb 5 (Reuters) - ASE Technology Holding, the world's largest chip packaging and testing provider, on Thursday said ...

Q4 2025 Management View Group COO Tien Wu outlined a multiyear outlook, emphasizing that "the AI server cycle continues, primarily led by hyperscaler and the data center development." Wu reported that ...

WENZHOU, ZHEJIANG PROVINCE, CHINA, January 19, 2026 /EINPresswire.com/ -- As the global pharmaceutical and healthcare ...

OSAT leader ASE Technology Holding is optimistic that its growth momentum will extend through 2026 and beyond, benefiting ...

The Department of Commerce is investing up to $300 million to accelerate the development of technologies to boost the semiconductor industry. The department said Thursday the three entities receiving ...

Diamond Quanta today announced Adamantine Thermal(TM), an engineered-diamond thermal platform designed for integration into advanced packaging workflows and heterogeneous semiconductor systems. The ...

Just as the new plant located in Nanke Chiayi Park in Taiwan is expanding production, the downstream supply chain broke news that TSMC is eyeing off going to Pingtung to build a new CoWoS advanced ...

The world of AI chips hasn't stopped, and won't stop, with advanced packaging production capacity in short supply. TSMC's new CoWoS plant in Nanke Chiayi Park is entering the "environmental review ...

At the forefront of this high-stakes industry stands Capcon Limited — a dynamic Singapore-based company that has rapidly ...

Advanced packaging is no longer operating behind the scenes. The technology of advanced packaging is helping to sustain the speed of the semiconductor industry’s improvement in power and performance, ...

FIC Global, Inc. (TWSE: 3701; FICG), with PRIME Technology as its optical communications brand, will participate in Asia ...

FPT Announces the Establishment of an Advanced Semiconductor Testing & Packaging Plant ...