CHANGZHOU, JIANGSU, CHINA, March 20, 2026 /EINPresswire.com/ -- The landscape of modern industrial technology is ...

New Software Development Kit Brings High-Performance Thermal Simulation And GPU-Accelerated Speed To Integrated Engineering Workflows.

Electronic packaging has continued to become more complex with higher device count, higher power densities and Heterogeneous Integration (HI) becoming more common. In the mobile space, systems that ...

Electromagnetic-thermal co-simulation methods integrate the numerical assessment of electromagnetic fields with thermal analysis to predict the coupled behaviour of systems in which heat generation ...

Artificial intelligence (AI) is no longer a research concept — it is the economic engine driving infrastructure investment worldwide. The growth of AI data centers, powered by high-performance CPUs, ...

SAN JOSE, Calif.--(BUSINESS WIRE)--Cadence Design Systems, Inc. (NASDAQ: CDNS) today expanded its presence in the system analysis and design market with the introduction of the Cadence ® Celsius ™ ...

Analog fabs are bolstering their electronic design automation (EDA) tool repository to complement design flows in advanced RF devices, and the latest example comes from Tower Semiconductor’s adoption ...

The shift to advanced packaging in 3D and 2.5D IC design is making the numerical analysis of thermal warpage in electronic devices a crucial part of the design process. A reliable numerical tool ...

One of ANSTO's advanced imaging instruments Dingo now delivers a rare fusion of simulation and radiobiology, becoming a launchpad for an innovative neutron therapy innovation. This unique scientific ...

With concerns over air pollution and petroleum supplies, the use of hybrid electric vehicles (HEVs) and electric vehicles (EVs) have come to the forefront as alternatives to conventional gasoline and ...