Mastering board-level insulation principles like clearance, creepage, and dielectric strength is key to preventing arcing and ...

With shrinking chip sizes, Wafer Level Packaging (WLP) is becoming an attractive packaging technology with many advantages in comparison to standard Ball Grid Array (BGA) packages. With the ...

When it comes to reducing form-factor and increasing functional integration of mobile devices, Wafer Level Packaging (WLP) is an attractive packaging solution with many advantages in comparison to ...

Endicott, N.Y.— Endicott Interconnect Technologies has developed a semiconductor package marketed under the brand-name CoreEZ, which uses an organic, thin core build-up flip chip technology that ...

The first two installments in this series reported in detail on field reliability experience of Efficient Power Conversion (EPC) Corporation’s enhancement-mode gallium nitride (eGaN®) FETs and ...

Historically, the speed and complexity of electronic circuits required for manufacturing has out-matched the interconnects used to join circuits together. A first approximation of interconnect ...

High-reliability rad hard MOSFETs undergo extensive screening and quality conformance testing to ensure that devices perform to specification in the harshest environments. For Defense Logistics Agency ...

Reliability allocation methods play a pivotal role in engineering, serving as the means by which system-level reliability requirements are systematically distributed among individual subsystems and ...