The performance of today’ electronic products relies heavily on the integrity of the tiny connections between microchips and circuits, which can number as many as 2,200. These bonds are tested ...

Wire bonding, a foundational process in microelectronics, is essential to establishing a robust and low-resistance electrical connection between semiconductor chips and their respective packages or, ...

Part of the HYAMP III series of manual ground-bond testers from Associated Research, the Model 3145 provides up to 40 A of DC ground-bond test current for alternative-energy and solar test ...

Bernstein has identified key players in the chip testing and advanced packaging sector that are positioned to benefit from growing demand for artificial intelligence chips and increasingly complex ...