NuTool Inc. today introduced a copper chemical mechanical planarization (CMP) process using fixed abrasive for copper polish on Ultra Low-k dielectrics. The polishing process, which demonstrated a ...
Lam Research Corp. has introduced a new platen for its 200mm Teres chemical mechanical planarization (CMP) system. The extra die (XD) platen extends the control from CMP processes to within 2mm of the ...
USA: Demonstrating its expertise in precision materials engineering, Applied Materials Inc. announced two new systems that help customers solve critical challenges in manufacturing high-performance, ...
BANGALORE, INDIA: Applied Materials, Inc., announced on Monday the extension of its successful Applied Reflexion GT CMP1 system to include the planarization of tungsten films. This CMP process is ...
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