Companies advance multi-die planning and implementation, leveraging Cadence’s Integrity 3D-IC platform, the industry’s only unified platform that combines system planning, packaging and system-level ...
The Cadence 3D-IC solution centers on the Integrity 3D-IC platform, which provides integrated planning, implementation and system analysis to optimize PPA for multi-chiplet systems The Tempus Timing ...
HSINCHU, Taiwan & SAN JOSE, Calif.--(BUSINESS WIRE)-- United Microelectronics Corporation (NYSE: UMC; TWSE: 2303) (“UMC”), a leading global semiconductor foundry, and Cadence Design Systems, Inc.
SAN JOSE, Calif. -- October 26, 2021-- Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that it is working with TSMC to accelerate 3D-IC multi-chiplet design innovation. As part of the ...
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