System-in-Package (SiP) technology has been used for a wide range of electronic devices, but the warpage behavior of the package can be difficult to control and predict due to complex manufacturing ...

Injection overmolding of unidirectional fibers and preforms is an attractive process for many good reasons. It’s fast, consistent and repeatable, and it can be performed with a machine that is ...

Compression molding involves forming of complex shaped components by molding of a charge of fiber reinforced prepreg bulk molding compound (BMC) under heat and high pressures. Unidirectional fiber ...

Today’s fan-out wafer-level packaging (FOWLP) processes use organic substrates composed of epoxy mold compound (EMC) created using a thermal compression process. EMC wafers are a cost-effective way to ...