Advanced packaging continues to promise improved form factor, cost, performance, and functionality compared to the traditional transistor scaling on SoCs. This is done by integrating multiple dies on ...
Miniaturization of consumer products, aerospace and defense systems, medical devices, and LED arrays has spawned the development of a technology known as the multi-chip module (MCM), which combines ...
SANTA CLARA, Calif.--(BUSINESS WIRE)--TSMC (TSE: 2330, NYSE: TSM) today announced the new 3Dblox 2.0 open standard and major achievements of its Open Innovation Platform ® (OIP) 3DFabric Alliance at ...
Taiwan Semiconductor Manufacturing Co. (TSMC) today released what it believes is the first manufacturability-focused IC design flow that is silicon-proven in its 0.25-micron and 0.18-micron ...
SAN JOSE, Calif.--(BUSINESS WIRE)--Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that Samsung Foundry has certified an 8nm RFIC design reference flow to develop 5G RFICs for use with sub ...
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