Feb. 21, 2024 — EDA software company Cadence and Intel Foundry have collaborated to develop an integrated advanced packaging flow utilizing Embedded Multi-die Interconnect Bridge (EMIB) technology to ...
The terms “chiplet” and “heterogeneous integration” fill news pages, conference papers, and marketing presentations, and for the most part engineers understand what they’re reading. But speakers ...
Semiconductor Engineering sat down to discuss heterogeneous integration with Dick Otte, president and CEO of Promex Industries; Mike Kelly, vice president of chiplets/FCBGA integration at Amkor ...
Scientists in NEXT Lab, Tsinghua University have revealed the fabrication and engineering techniques of TMDs and provided a comparative view between TMDs and traditional semiconductors, demonstrating ...
TOKYO--(BUSINESS WIRE)--OKI (TOKYO: 6703) has successfully developed Tiling crystal film bonding (CFB; Note 1) technology using its proprietary CFB technology. This technology makes possible the ...
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