Waterbury, CT. MacDermid Enthone Electronics Solutions has announced the release of the Affinity ENIG 2.0 process, a high-reliability, low-variation electroless-nickel immersion-gold plating process.
Today’s electronic packages have high clock speeds (multi-gigahertz range), fine pin densities (below 0.4-mm pitch), and high pin counts (over 2000). When assembled onto a printed-circuit board (PCB), ...
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