New validation solutions enable data center operators to overcome bandwidth, latency, and interoperability challenges as AI ...

JEDEC’s HBM4 and the emerging SPHBM4 standard boost bandwidth and expand packaging options, helping AI and HPC systems push past the memory and I/O walls.

Teradyne rides on a 45% semiconductor test revenue surge fueled by AI compute, with 2026 growth tied closely to booming AI ...

The rapid advancement of artificial intelligence (AI) is driving unprecedented demand for high-performance memory solutions. AI-driven applications are fueling significant year-over-year growth in ...

AI data centers are hitting speed and bandwidth limits. The test tools promise to fix hidden link issues before they slow everything down.

SPHBM4 cuts pin counts dramatically while preserving hyperscale-class bandwidth performance Organic substrates reduce packaging costs and relax routing constraints in HBM designs Serialization shifts ...

The next generation of high-bandwidth memory, HBM4, was widely expected to require hybrid bonding to unlock a 16-high memory stack. A JEDEC move made that unnecessary with this generation, but it’s ...

Samsung moves up its HBM4 production schedule and begins preparing for mass output of next generation high bandwidth memory chips. Nvidia chooses Samsung, not Micron Technology (NasdaqGS:MU), as a ...

Samsung Electronics' sixth-generation high-bandwidth memory, HBM4, has reportedly posted the fastest operating speeds in a key technology test run by Broadcom. The results strengthen the company's ...

Per-stack total memory bandwidth has increased by 2.7-times versus HBM3E, reaching up to 3.3 Tb/s. With 12-layer stacking, Samsung is offering HBM4 in capacities from 24 gigabytes (GB) to 36 GB, and ...