Today’s 3D integrated circuit (3D-IC) technology is the culmination of 40 years of research in universities and laboratories scattered across the globe. Beginning with dynamic random-access memory ...
Innovation in semiconductor design today is energized primarily by AI/ML, data centers, autonomous and electric vehicles, 5G/6G, and IoT. Recently developed 2.5 and 3D-IC silicon-based packaging ...
The continuing advancements in semiconductor technology have led to production flows for 130nm, 90nm and below, enabling 40 million-plus gate chips to be reliably manufactured. This article explores ...
June 24, 2024 -- Plano, Texas, USA -- Siemens Digital Industries Software today introduced Solido™ Simulation Suite software(“Solido Sim” software), an integrated suite of AI-accelerated SPICE, Fast ...
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