“I welcome Intel’s decision to begin operations for the complex later this year,” a translated version of Ibrahim’s post read. An Intel spokesperson, John Hipsher, confirmed that it’s building out additional chip assembly and test capacity in Penang, “amid rising global demand for Intel Foundry packaging solutions.”

This is exactly the kind of anchor customer the Intel Foundry business has been trying to land since Pat Gelsinger first pitched IDM 2.0.

Advanced packaging has quietly become the make-or-break factor in the AI race. Hyperscalers need to combine chiplets, high-bandwidth memory, and dense interconnects into powerful final packages that overcome the physical limits of printing ever-larger chips on a single wafer.

Forbes contributors publish independent expert analyses and insights. Dave Altavilla is a Tech Analyst covering chips, compute and AI. Intel came to its annual Tech Tour last week not to tease incremental updates, but to draw a line in the silicon ...

TL;DR: Intel's new Fab 52 in Chandler, Arizona, produces the most advanced US-made logic chips using the cutting-edge 18A process node, featuring RibbonFET and PowerVia innovations. This facility is part of Intel's $100 billion investment to expand ...

Intel's (NASDAQ: INTC) foundry strategy until recently could be summed up as "if you build it, they will come." The company poured capital into manufacturing facilities and raced to bring new manufacturing processes into production. The Intel 18A process ...

Well, now this is unexpected. Analyst Ming-Chi Kuo has just revealed that Intel is expected to begin shipping Apple's M-series processors in 2027. This would mark a huge comeback of the partnership between the two companies, which Apple started to move ...

The semiconductor company will now wholly own Fab 34 after spending $14.2 billion to repurchase the 49% stake it sold to Apollo Global Management two years ago.