Printed Circuit Design & Fab Online Magazine

Rethinking the basics of PCB and IC Substrate manufacturing with mSAP

SAP enables AT&S to manufacture printed circuit boards and IC substrates of a size and complexity that almost rivals products from the semi-conductor industry. mSAP stands for “modified semi-additive ...
Yahoo Finance

SCHMID Group secures major orders for Panel Level Packaging (PLP) and modified-Semi-Additive (mSAP) production equipment

SCHMID Group secures Major Orders for AI Server PCB Production Equipment Freudenstadt, In one project, SCHMID will deliver a complete wet-process equipment setup featuring its advanced V+ and H+ ...
EDN

Orbotech’s New Nuvogo™ Direct Imaging Systems for Advanced HDI, Including mSAP Production Process

ORBOTECH LTD. (NASDAQ: ORBK), a leading provider of process innovation technologies, solutions and equipment serving the global electronics manufacturing industry, today launched the Nuvogo Fine at ...
Seeking Alpha

SCHMID Group secures major orders for Panel Level Packaging (PLP) and modified-Semi-Additive (mSAP) production equipment

FREUDENSTADT, Germany, Nov. 10, 2025 (GLOBE NEWSWIRE) -- SCHMID Group (SHMD), a global equipment maker and solution provider for Printed Circuit Boards (PCB) and IC-Substrate manufacturing, today ...