Beaverton, Ore. – The 10-Gigabit (Gbit/second) MiniPHY-300 optical-networking module from Network Elements Inc. is targeted for use in dense wavelength-division multiplexing, synchronous optical ...

Broadcom Inc. today debuted two new chips, the Sian3 and Sian2M, that data center operators can use to power their optical networks. Optical networks are often used to link together the servers in ...

Around the world, adoption of high-speed communication technologies continues to accelerate as data demands escalate among consumers and businesses alike. With the rising demands on bandwidth, network ...

TORONTO and SAN DIEGO, March 26, 2024 (GLOBE NEWSWIRE) -- POET Technologies Inc. (POET), the designer and developer of the POET Optical Interposer™ and Photonic Integrated Circuits (PICs) for the data ...

FREMONT, Calif.--(BUSINESS WIRE)--Activity was high at OIF’s Q2 2021 Technical and MA&E Committees Meeting, held virtually May 10-14. Members initiated three new innovative projects, including a ...

Broadcom Inc. today debuted a new chip, the Sian2, for powering the high-speed optical networks that underpin artificial intelligence clusters. The company says that the module provides twice the ...

POET Technologies is climbing the value ladder, transitioning from supplying optical engines to offering full optical transceiver modules. Its optical interposer combines photonic and electronic parts ...

Shenzhen, China - FiberMall, a provider of optical networking solutions, today announced that the company has initiated ...

Sanmina Corporation SANM is increasingly focused on advancing high-speed network infrastructure through its fiber expertise, ...

SAN DIEGO--(BUSINESS WIRE)--The Consortium for On-Board Optics (COBO) today published release 1.0 of its on-board optical module specification capable of supporting up to 800Gbps. The specification ...

Fiber optic technology is the backbone of modern digital infrastructure, and recent innovations are propelling its capabilities to new heights. In the past few years, breakthroughs in materials, ...

IBM is developing co-packaged optics (CPO) technology to replace conventional electrical interconnects in chips, which it says will speed up AI model training and increase energy efficiency for data ...