The molding materials used to package lead-free components differ from conventional epoxies in two ways: They take up moisture more slowly, and they better resist higher temperatures. But at the ...
The result is that the entire board is much denser, and comments can be installed on both sides of the PC board, as seen in Figure 2 . Since the board does not require drilling for component leads ...
Board manufacturers are boosting their investment in inspection, test and analytics to meet the increasingly stringent demands for reliability in safety-critical sectors like automotive. This ...
It’s not too hard to make your electronics project get warm. Design your traces too small, accidentally short the battery inputs together, maybe reverse the voltage going to your MCU. We’ve all cooked ...
This new technical paper titled “End-to-end deep learning framework for printed circuit board manufacturing defect classification” is from researchers at École de technologie supérieure (ÉTS) in ...
Conversely,experienced embedded designers know to mask or tent BGA vias at thedesign and layout level. Even when this step is omitted, adesign-for-manufacture (DFM) check mapped out at the planning ...
It has taken almost a decade for automated optical inspection (AOI) systems to establish their place on PCB production lines. In the same period, the number of AOI vendors and the variety of AOI ...
As electronic products move from prototyping to mass production, manufacturers must rely on efficient, scalable, and ...
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