Rethinking the operation could unlock more productivity, and the key to successful automated reverse packaging hinges on ...
The scientists used sliced bologna tainted with Listeria monocytogenes, packaged it in vacuum-sealed plastic bags, and then submerged the packages in hot water, said lead researcher Tim Haley of ...
Designed for nanometer-scale silicon ICs, a new wire-bond chip-packaging process–called Pad on I/O–by chip manufacturer LSI Logic (Milpitas, CA) places bond pads directly on active copper/low-K ...