USI, a global leader in electronic design and manufacturing services, today announced a breakthrough in advanced power semiconductor packaging technology designed for next-generation power solutions.
As AI data centres continue to scale, token generation is limited by power availability, while efficiency is a defining factor for return on investment. Traditional architectures based on bulky, ...
Founded in 1987, Boschman Technologies B.V. is a manufacturer of sintering equipment and transfer molding technology for advanced packaging of automotive and industrial power modules, MEMS sensors. In ...
The quest for ever-higher power densities has encouraged the rise of breathtaking levels of active/passive device integration and cool-running packaging technology. Advanced packaging technologies are ...
In an exclusive interview with TI’s director of power management R&D, we explore the role of advanced packaging in low-voltage power electronics. From state-of-the-art materials and process technology ...
Microchip Technology (Nasdaq: MCHP) today announces the availability of its new 3.3 kV HV ‑ D3 mSiC ® Power Modules, designed to simplify and accelerate the adoption of solid-state transformers (SSTs) ...
With the explosive increase in demand for artificial intelligence (AI), autonomous driving, Internet of Things (IoT), data centers, augmented reality and virtual reality (AR/VR), the market of ...
Wolfspeed has introduced two new 3.3 kV silicon carbide (SiC) power module families – including high-power half-bridge ...
Microchip Technology has launched a new range of 3.3 kV silicon carbide (SiC) power modules to support SST designs.
Founded in 2020, Powertrim Technologies is a provider of back-end packaging equipment for power modules. Rooted in over 40 years of semiconductor trim and form toolmaking heritage, the company offers ...
Engineers at the Department of Energy’s Oak Ridge National Laboratory have developed a new ...
Wolfspeed’s 3.3-kV SiC power modules target AI data centers, renewable energy systems, and grid infrastructure.