Maia 200 packs 140+ billion transistors, 216 GB of HBM3E, and a massive 272 MB of on-chip SRAM to tackle the efficiency crisis in real-time inference. Hyperscalers prioritiz ...
Designed using TSMC’s 3nm process technology, company has already deployed chip in its US Central data center region ...
Low power Static Random-Access Memory (SRAM) design remains at the forefront of research in modern electronics due to its critical role in minimising energy consumption while maintaining high ...
Management expects the consistent demand for high-density SRAM to continue in fiscal 2026, although some variability in shipment timing is anticipated. Follow-on orders for radiation-hardened SRAM are ...
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