A multi-domain passive module with functionality embedded in the substrate has been developed by Saras Micro Devices. The Saras Tile, or STILE, enables power regulation from system board to package.

Tessera Technologies Inc. has unveiled a tiny stacking package that enables users to mix and match independently tested silicon devices and stack them within a single-chip footprint. The company's ...

Bernstein has identified key players in the chip testing and advanced packaging sector that are positioned to benefit from growing demand for artificial intelligence chips and increasingly complex ...

The semiconductor industry is a hallmark of technological innovation, evolving rapidly to meet the demands of an increasingly digital world. At its core, semiconductor manufacturing involves two main ...

Designing, integrating and assembling heterogeneous packages from blocks developed at any process node or cost point is proving to be far more difficult than expected, particularly where high ...