Ajinomoto build-up film (ABF) substrate has been a key component in chip manufacturing since its introduction shortly before the turn of the millennium. Substrates made with Ajinomoto build-up film – ...
QINGPU, SHANGHAI, CHINA, February 12, 2026 /EINPresswire.com/ -- Introduction: The Foundation of Packaging Performance ...
New portfolio drives chip performance with panel-based interconnect innovation KLA is extending the capability of the proven Corus™ direct imaging platform and introducing the Serena™ direct imaging ...
Electronic waste and its associated pollution are becoming increasingly threatening on a global scale. With the continued development of various new application areas including robots, wearable ...
QINGPU, SHANGHAI, CHINA, February 12, 2026 /EINPresswire.com/ — Introduction: The Evolving Landscape of China’s BOPP Industry China’s BOPP (Biaxially Oriented Polypropylene) film manufacturing sector ...
Momentum is building for IC packages based on an emerging technology called molded interconnect substrate (MIS). ASE, Carsem, JCET/STATS ChipPAC, Unisem and others are developing IC packages based on ...
Geneva (Switzerland) and Bernin (France), December 1, 2022 — STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, and Soitec ...
FREUDENSTADT, Germany, Oct. 22, 2025 (GLOBE NEWSWIRE) -- SCHMID Group (NASDAQ: SHMD), a global equipment maker and solution provider for Printed Circuit Boards (PCB) and IC-Substrate manufacturing – ...
The Sino-US trade war has accelerated global competition in compound semiconductors, with Chinese manufacturers now aggressively targeting price reductions in silicon carbide (SiC)... The US has ...
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