In my previous column (see “Editor's Picks,” at right), I discussed transverse flexural testing of a unidirectional composite as one method of evaluating the strength of the fiber/matrix interfacial ...

Traditional IC pattern-generation methods focus on detectingdefects at gate terminals or at interconnects. Unfortunately, a significantpopulation of defects may occur within an IC's gates, or cells.

Until the mid-1970s, compression testing of composite materials received relatively little attention. Up to that point it, had generally been assumed that the compressive stiffness was approximately ...