Electronic packaging has continued to become more complex with higher device count, higher power densities and Heterogeneous Integration (HI) becoming more common. In the mobile space, systems that ...
An international research group led by China’s Zhejiang University has developed a proof-of-concept compression-assisted adsorption thermal battery (CATB) prototype, using solar thermal collectors.
The drive for better efficiency in the power electronics industry has generated enormous gains in the last few years. The design of power semiconductors has improved, silicon carbide (SiC) and gallium ...
When designing electronics, heat dissipated to the surroundings by micro devices is an important consideration because heat has a powerful and stringent effect on their operation and lifespan. When an ...
Fabric might be the last thing on your mind when firefighters rescue someone from a burning building, but without fire-resistant clothing, such rescues might not happen at all. The turnout gear that ...
Electromagnetic-thermal co-simulation methods integrate the numerical assessment of electromagnetic fields with thermal analysis to predict the coupled behaviour of systems in which heat generation ...
Cost-effective in-rack systems enable testing of standard 30kW or 50kW NeuCool liquid-cooled racks without multi-million-dollar hardware investments Custom testing configurations available, including ...
It’s costly and time-consuming to determine the causes of hotspots on circuit boards, and to attempt to arrive at a “well-tempered” board through multiple iterations once a prototype is approved. A ...
Vishay Intertechnology, Inc. introduced a new version of its free ThermaSim online thermal simulation tool for power MOSFETs, microBUCK® power ICs, and DrMOS products: ThermaSim 3.0. For precise ...
Malvern, Penna.—Vishay says its free ThermaSim simulation tool for MOSFETs is the first such on-line product to use finite-element-analysis (FEA) models for increased accuracy. ThermaSim, ...
The lab focuses on the physical simulation of processes that are related to mechanical engineering, material science, ceramics, civil engineering and metallurgy. The Thermal Mechanical Physical ...
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