Wafer inspection has become a critical part of the semiconductor manufacturing process. Inspections performed after wafer test can analyze the marks left by probe cards to ensure that the test process ...

In a heterogeneous integrated system, the impact of composite yield fallout due to a single chiplet is creating new performance imperatives for wafer test in terms of test complexity and coverage.

Detecting macro-defects early in the wafer processing flow is vital for yield and process improvement, and it is driving innovations in both inspection techniques and wafer test map analysis. At the ...

Motorola Inc.’s semiconductor products sector (SPS) today said it has developed and qualified the first wafer level burn-in and test (WLBT) process for flip-chip microprocessors. Motorola aims to ...

In this interview, Dr. Chady Stephan, PhD, the Applied Markets Leader at PerkinElmer, talks to AZoM about the current trends shaping semiconductor wafer manufacturing. A semiconductor is a material ...

Keeping an IC cool takes on new meaning when power dissipation exceeds 150 watts. Innovative electrical and mechanical solutions to new wafer testing challenges continue to be developed. For example, ...

FREMONT, CA / ACCESS Newswire / August 26, 2025 / Aehr Test Systems (AEHR), a worldwide supplier of semiconductor test and burn-in equipment, today announced it has received a purchase order from a ...

(NASDAQ: FORM), a leading provider of RF probe stations and probe cards, and Rohde & Schwarz, a global leader in test and measurement, today announced a strategic co-marketing partnership as part of ...

LIVERMORE, Calif., May 29, 2020 (GLOBE NEWSWIRE) -- FormFactor, Inc. (NASDAQ:FORM), a leading semiconductor test and measurement supplier, today announced the release of the SmartMatrix 3000XP probe ...

CompoundTek, the silicon photonics wafer foundry based in Singapore, has agreed a strategic collaboration with Taiwan's STAr Technologies that will aim to speed the technology’s move to large-scale ...