Parallel piezo aligners with fly height sensors enable faster PIC wafer testing.

The move to multi-die packaging is driving chipmakers to develop more cost-effective ways to ensure only known-good die are integrated into packages, because the price of failure is significantly ...

Delicate features, uneven surfaces, and extreme density make it difficult to manage probe force and ensure reliability.

Cascade Microtech Inc. today will field a characterization system that it says can shave weeks off the power semiconductor development cycle. The Tesla probe station allows power semiconductors to be ...

Increased productivity and efficiency with one-pass test enabled by a high-voltage switching matrix Designed to enhance the safety of operators and equipment; complies with regulations SANTA ROSA, ...

FREMONT, CA / ACCESSWIRE / December 14, 2023 / Aehr Test Systems (NASDAQ:AEHR), a worldwide supplier of semiconductor test and burn-in equipment, today announced it has received an initial customer ...

FREMONT, CA / ACCESS Newswire / August 26, 2025 / Aehr Test Systems (AEHR), a worldwide supplier of semiconductor test and burn-in equipment, today announced it has received a purchase order from a ...

This higher density of circuitry on a wafer requires greater accuracy and a highly fragile and advanced fabrication process. Several newer and highly complex ICs today are made of a dozen or more ...

Hermes Testing Solutions Inc. (HTSI), a provider of semiconductor wafer testing solutions, said demand for flexible and highly customized testing equipment is increasing as advanced process nodes ...

The recent global shortage of automotive chips has brought Taiwan's semiconductor industry into the focus of worldwide attention. The real cause of why Taiwan's semiconductor chips are in such great ...