The world’s largest and most influential semiconductor companies have been cogitating about migrating to 450-mm wafer technology for years, and many of Europe's major chipmakers are still becalmed in ...

A panel-level (PL) approach to fan-out (FO) packaging has been discussed for several years to reduce the cost of chip-first FO packaging based on redistribution layer (RDL) technology. More recently, ...

Infineon has introduced 300-mm power GaN wafer technology within a scalable, high-volume manufacturing environment. The company notes that 300-mm wafers offer significant technological and efficiency ...