An interposer performs a similar function as a printed circuit board (PCB), but when the interposer is moved inside a package the impact is significant. Neither legacy PCB nor IC design tools can ...
The miniaturization trend in electronic devices and the rise in smart and IoT device segments make adopting heterogeneous integration of chip components or 3D-ICs a viable option for miniaturization ...
Scientists at Tokyo Institute of Technology develop a 3D functional interposer--the interface between a chip and the package substrate--containing an embedded capacitor. This compact design saves a ...
GLOBALFOUNDRIES Introduces Certified Design Flows for Multi-Die Integration Using 2.5D IC Technology
MILPITAS, Calif.--(BUSINESS WIRE)--At next week’s 50th Design Automation Conference (DAC) in Austin, Texas, GLOBALFOUNDRIES will unveil a comprehensive set of certified design flows to support 2.5D IC ...
Richardson, TX (Sept. 22, 2009) – With ASSET® InterTech’s new LGA1366 interposer, design, test and field repair engineers are able to access the debug port on the Intel® Xeon® Processor 5500 Series ...
MILPITAS, Calif., Sept. 21, 2021 /PRNewswire/ -- Teledyne LeCroy, the worldwide leader in protocol test solutions, today announced availability of the PCI Express 5.0 M.2 interposer for analysis of ...
May 19, 2014. Agilent Technologies Inc. has introduced two new interposer solutions for testing DDR4 and DDR3 DRAM designs with a logic analyzer. Both interposer solutions provide fast, accurate ...
Colorado Springs, Colo.—FuturePlus Systems Corp. has introduced the FS2355 DDR3 1333 interposer preprocessor for next-generation DDR SDRAM buses. The FS2355 preprocessor offers flexibility and ...
KISSIMMEE, Fla.--(BUSINESS WIRE)--SkyWater Technology (NASDAQ: SKYT), the trusted technology realization partner and BRIDG, a not-for-profit, public-private-partnership for the fabrication of ...
Heralded as the fastest DDR3 interposer for use with Tektronix TLA7000 series logic analyzers, the FS2355 DDR3 1333 interposer preprocessor for next-generation DDR SDRAM buses promises to enhance the ...
MILPITAS, Calif., Feb. 14, 2023 /PRNewswire/ -- Teledyne LeCroy, the worldwide leader in protocol test solutions, today announced availability of their PCI Express (PCIe®) 6.0 CEM x16 interposer for ...
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