During femtosecond laser fabrication, photons are mainly absorbed by electrons, and the subsequent energy transfer from electrons to ions is of picosecond order. Hence, lattice motion is negligible ...

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Abstract: Hybrid wafer bonding is a key technology for enabling fine-pitch 3-D integration, yet its quality remains highly sensitive to wafer warpage and misalignment. This study develops a 3-D finite ...

[](https://www.youtube.com/watch?v=rUsg69-d3ws "Piston-crank kinematic modeling ...

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