Abstract: In this paper our 3D chip stacking technologies for CMOS image sensors (CISs) are introduced. We have developed wafer-to-wafer bonding technology for back-illuminated CIS (BICIS) and have ...
Abstract: The proliferation of machine-learning workloads has accelerated the demand for higher memory bandwidth in modern systems. HBM DRAM was developed to break through the system-performance limit ...
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