Abstract: In this letter, a high-efficiency planar all-metal folded reflectarray adopting polarization conversion element with a continuous 360° phase is proposed. It contains three parts, a bottom ...
Abstract: This paper presents the bending analysis of stress-sensor chips of 300 µm and 100 µm thickness. Previous work on similar topics is usually heavily focused on ultra-thin chips (≤20 µm) and ...
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