Note: This book is the first edition of Quantitative Finance with Case Studies in Python. For readers of the second edition, please go to this repo.
High-Temperature Encapsulation Materials for Power Modules: Technology and Future Development Trends
Abstract: The applications of wide bandgap (WBG) semiconductors represented by silicon carbide (SiC) and gallium nitride (GaN) in power modules are currently limited by the thermal stability of ...
Abstract: The insulating properties of silicone gel, which is widely used as the encapsulation of power electronic modules, directly determine their electrical insulation reliability, so the effects ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results