IEEE

MORE-Stress: Model Order Reduction based Efficient Numerical Algorithm for Thermal Stress Simulation of TSV Arrays in 2.5D/3D IC

Abstract: Thermomechanical stress induced by through-silicon vias (TSVs) plays an important role in the performance and reliability analysis of 2.5D/3D ICs. While the finite element method (FEM) ...

Neutral-atom arrays, a rapidly emerging quantum computing platform, get a boost from researchers

For quantum computers to outperform their classical counterparts, they need more quantum bits, or qubits. State-of-the-art ...
American Institute of Physics

Generating 5 million truly random bits each second

Nanoscale device employs magnetic tunnel junctions to convert thermal noise into binary signals for random number generation.
IEEE

Analysis of Conformal Periodic Arrays Using Cylindrically Periodic Stratified Media Green’s Functions and PWS-MoM

Abstract: A cylindrically periodic stratified media Green’s functions (CPSMGFs) method is proposed to analyze conformal arrays through one array unit. The CPSMGFs are developed on electric dyadic ...